Dicing

  • Micro Automation 1006

    MicroAutomation 1006 is a tool used for dicing wafers used in semiconductor manufacture into chips for packaging. It is capable of dicing up to 150 mm diameter wafers while the air bearing spindle speed can be adjusted between 10,000 to 40,000 rpm for dicing different types of materials, such as silicon glass and thin metallic substrates.

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Fab Notices

  • Oxford Plasma Lab System

    The Oxford Plasma Lab system will be down for parts replacement purposes. Updates as to when the equipment will be back online will be posted shortly.

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  • Thermal Evaporator

    The Thermal Evaporator will be down approximately until December 11th, 2017 for repair of the cryopump. Further updates will be posted on the website.

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Upcoming Events

Kostas Center News

  • Publications

    1. Congratulations to the members of the Advanced Manufacturing, Energy Storage, and Multifunctional Materials group for publishing "Stable and Aligne

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Contact Kostas Center

448 Egan Center, 360 Huntington Ave., Boston, Massachusetts 02115 Phone: 617-373-5848
Email: s.somu@neu.edu