Wirebonding

  • MIE wire Bonder

    MEI is a wire bonding system that is used to bond chips to holders for quick functionality testing and packaging. The bonding process is based on thermocompression or thermosonic ball bonding using gold wire. The system can handle wire diameters from 17um to 75um and are available with a full line of work holder and options to fit all applications. A digital heat control is present to regulate substrate temperature from ambient to 90°C.

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Fab Notices

  • Oxford Plasma Lab System

    The Oxford Plasma Lab system will be down for parts replacement purposes. Updates as to when the equipment will be back online will be posted shortly.

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  • Thermal Evaporator

    The Thermal Evaporator will be down approximately until December 11th, 2017 for repair of the cryopump. Further updates will be posted on the website.

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Upcoming Events

Kostas Center News

  • Publications

    1. Congratulations to the members of the Advanced Manufacturing, Energy Storage, and Multifunctional Materials group for publishing "Stable and Aligne

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Contact Kostas Center

448 Egan Center, 360 Huntington Ave., Boston, Massachusetts 02115 Phone: 617-373-5848
Email: s.somu@neu.edu