Description

The Perkin-Elmer 2400 system is three target magnetron-sputtering system with capability of performing sequential deposition from DC magnetron, RF magnetron and conventional RF cathodes. Metals and dielectrics can be deposited at higher rates while maintaining low substrate temperature in both RF and DC magnetron deposition modes. The rotating substrate allows for single pass or multi-pass capability with servo-match automatic turning for achieving high uniformity of the deposited materials.

Additional Resources