MRC 8667 is an automated cylindrical chamber R&D batch sputtering systems feature horizontal "Sputter Down" mode of sputtering in three target positions, DC magnetron, RF magnetron mode capabilities at each target position. A circular rotating water-cooled annular substrate table is capable of being RF Biased for substrate RF sputter etching.. A main circular rotating shutter is utilized to prevent contamination between adjacent targets and a separate paddle shutter is present to safe guard the heater or forth target from being sputtered or etched upon. Contact staff for available targets.

Additional Resources

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