Description

The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes 100mm. Even though this tool supports all common wafer bonding processes such as anodic glass frit, solder, eutectic, transient liquid phase, and direct it is primarily geared towards anodic bonding. Coupled with EVG 610 mask aligner one can align and then bond using a bond chuck.

Additional Resources

EVG 501 Bonder
Training Contact: Sivasubramanian Somu
Service Contact: Scott McNamara