MicroAutomation 1006 is a tool used for dicing wafers used in semiconductor manufacture into chips for packaging. It is capable of dicing up to 150 mm diameter wafers while the air bearing spindle speed can be adjusted between 10,000 to 40,000 rpm for dicing different types of materials, such as silicon glass and thin metallic substrates.

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Micro Automation 1006
Training Contact: Sivasubramanian Somu
Service Contact: Scott McNamara