MEI is a wire bonding system that is used to bond chips to holders for quick functionality testing and packaging. The bonding process is based on thermocompression or thermosonic ball bonding using gold wire. The system can handle wire diameters from 17um to 75um and are available with a full line of work holder and options to fit all applications. A digital heat control is present to regulate substrate temperature from ambient to 90°C.

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MIE wire Bonder
Training Contact: Sivasubramanian Somu
Service Contact: Scott McNamara