XACTIC e1 tool uses XeF2 gas to isotropically dry etch silicon, germanium, and molybdenum for creating/releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes. It can process pieces up to 4" wafers and generates relatively rough isotropically etched features.

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Training Contact: Sivasubramanian Somu
Service Contact: Scott McNamara